האם לוחות אם תואמי RoHS הם בעלי אורך חיים קצר יותר מאשר אלו שלא תואמים?

[XTreeGoldv2]

שמעתי שלוחות-אם תואמי RoHS הם בעלי אורך חיים של מקסימום 4-5 שנים לעומת אלה שהם לא תואמים שיכולים להחזיק מעמד

אפילו עשר שנים (יש לי אחד כזה).

נדמה לי שזה קשור לחוזק ההלחמות.

[TheReaper]

http://en.wikipedia.org/wiki/ROHS

זה בכלל אי שימוש ב6 חומרים מסוכנים (על פי חוק)

או בקיצור- שטויות

[XTreeGoldv2]

זה בכלל אי שימוש ב6 חומרים מסוכנים (על פי חוק)

או בקיצור- שטויות

אם היית ממשיך לקרוא את הלינק שצרפת היית רואה הוכחה להפך הגמור...

בקיצור ממש לא שטויות

http://en.wikipedia.org/wiki/ROHS#Criticism

[TheReaper]

כנראה שהאנגלית שלך לוקה בחסר

Effect on reliability

Admission of reliability problems is found in Annex, item #7, of the RoHS directive itself, granting servers exemption from regulation until 2010.[18]

Another problem that lead-free solders face is the growth of tin whiskers. These thin strands of tin can grow and make contact with an adjacent trace, developing a short circuit. Tin whiskers have already been responsible for at least one failure at a nuclear power plant.[19] Other documented failures include satellites in orbit,[20] aircraft in flight,[21] and implanted medical pacemakers.[22] To help mitigate these potential problems, lead-free manufacturers are using a variety of approaches such as tin-zinc formulations that only produce non-conducting whiskers.[23]

Reliability decay of low-lead materials may be economically desirable for some consumer product companies because it provides a mechanism to enforce planned obsolescence and replacement. Ironically, this is the opposite of the claimed intent of RoHS legislation.

Some countries have exempted medical and telecommunication infrastructure products from the legislation.[24] However, this may be a moot point, as electronic component manufacturers convert their production lines to producing only lead-free parts, conventional parts with eutectic tin-lead solder will simply not be available, even for military, aerospace and industrial users. To the extent that only solder is involved, this is at least partially mitigated by many lead-free components' compatibility with lead-containing solder processes. Leadframe based components, such as QFPs, SOICs, and SOPs with gull wing leads, are generally compatible since the finish on the part leads contributes a small amount of material to the finished joint. However, components such as BGAs which come with lead-free solder balls and leadless parts are often not compatible with lead-containing processes.[25]